安勤科技

Processor

Intel® 13th Gen Core™ i9/i7/i5/i3 Processor (35W/65W)

Platform Controller Hub

Intel® H610E Chipset

System Memory

2 x SODIMM sockets support Dual Channel DDR5 4800MHz up to 64GB

I/O Chipset

Intel® H610E PCH

BIOS Information

AMI uEFI BIOS, 256Mb SPI Flash ROM

Watchdog Timer

H/W Reset, 5~255 seconds/5~255 minutes

H/W Status Monitor

CPU temperature monitoring, Voltage monitoring, CPU fan speed control

TPM

dTPM 2.0

SBC

MX610HD

M.2

1 x M.2 Key-E 2230 CNVi (PCIe x 1, USB 2.0)
1 x M.2 Key-M 2242/2280 (PCIe x 4)

M.2

1 x M.2 Key-M 2242/2280 NVMe (PCIe x 4, SATA3)

2.5 Drive Bay

1 x Internal 2.5” Drive Bay (12.5mm)

USB

2 x USB 2.0

Power Button

1 x PWR BTN w/LED

Reset Button

1 x RST Hidden BTN

LED Indicator

1 x Data Access LED

USB

2xUSB 3.2
2xUSB 2.0

COM Port

1xRS-232
2xRS-232/422/485

LAN Port

2 x RJ45

DP

1 x DP

HDMI

1 x HDMI

Audio

1 x Line-Out
1 x Mic-In

AC/DC Input

2 x Vdc Input

Antenna

4x Antenna w/cover

Graphic Chipset

Intel® Integrated UHD Graphic with Xe Architecture (CPU Dependent)

Resolution

HDMI 1.4b: 3840x2160@30Hz
DP++ 1.4a: 4096x2304@60Hz

Audio Codec

Realtek HD Audio

LAN Chipset

Intel® Ethernet Connection I219-V
Intel® Ethernet Controller I225-LM

Data Rate Per Port

1GbE (I219-V)
2.5GbE (I225-LM)

Voltage Input Spec.

+12/24Vdc

ACPI

Single power ATX support S0, S3, S4, S5

Power Mode

AT/ATX

Voltage Input Connector

Terminal Block/DC Jack

OS

Win10 / 11

Certification Information

CE
FCC Class A
UKCA

Operating Temp.

0°C~40°C (32°F~104°F) with 0.5m/s air flow

Storage Temp.

-30 ~ 60C° (-22°F ~ 140°F)

Operating Humidity

40°C @ 95% Relative Humidity, Non-condensing

Dimension (W x L x H)

215 x 210 x 55mm

Weight

2.2 kg

Vibration Test

Random Vibration Operation
1. Test PSD : 0.00454G²/Hz , 1.5 Grms
2. System condition : operation mode
3. Test frequency : 5~500 Hz
4. Test axis : X,Y and Z axis
5. Test time : 30 minutes per each axis
6. IEC60068-2-64 Test Fh

Sine Vibration test (Non-operation)
1. Test Acceleration : 2G
2. Test frequency : 5~500 Hz
3. Sweep：1 Oct/ per one minute. (logarithmic)
4. Test Axis : X,Y and Z axis
5. Test time :30 min. each axis
6. System condition : Non-Operating mode
7. Reference IEC 60068-2-6 Testing procedures

Package Vibration Test:
1. Test PSD : 0.026G²/Hz , 2.16 Grms
2. Test frequency : 5~500 Hz
3. Test axis : X,Y and Z axis
4. Test time : 30 minutes per each axis
5. IEC 60068-2-64 Test Fh

Shock Test

1. Wave from : Half Sine wave
2. Acceleration Rate : 10G
3. Duration Time : 11ms
4. No. of Shock：Z axis 300 times
5. Test Axis: Z axis
6. Operation mode
7. Reference IEC 60068-2-27 Testing procedures
Test Eb : SSD Shock Test

Drop Test

Package drop test
Reference ISTA 2A, Method : IEC-60068-2-32 Test : Ed
Test Ed : Drop Test
1. Test phase : One corner, three edges, six faces
2. Test high : 96.5cm
3. Package weight : 5.4Kg
4. Test drawing

Mounting Kit

Robber foots for horizontal

Items

1x BMX-T820
1x Table Stand kit
4x Rubber foot
1x Screw kit (For M.2, Table Stand, Drive Bay)
1x AC/DC adapter

Ordering Information

Intel® 13th Gen Core™ i9/i7/i5/i3® Processor with CPU Cooler System (CPU 35W)

BMX-T820-I9H-A1-1R (i9-13900TE)
BMX-T820-I7H-A1-1R (i7-13700TE)
BMX-T820-I5H-A1-1R (i5-13500TE)
BMX-T820-I3H-A1-1R (i3-13100TE)