安勤科技

AIB-Q6490

PRELIMINARY

規格

System Information

  • Processor

    QCS6490
    Qualcomm® Kryo™ 670, 8 cores, up to 2.7 GHz, 12 TOPS (INT8)

  • Processor

    QCS6490
    Qualcomm® Kryo™ 670, 8 cores, up to 2.7 GHz, 12 TOPS (INT8)

  • System Memory

    LPDDR4, 8GB (optional 4GB/16GB)

Expansion

  • M.2

    1 x M.2 B key 3052

  • M.2

    1 x M.2 B key 3052

  • Nano SIM slot

    1 x Nano SIM slot (push and pull)

  • uSD card

    1 x uSD3.0 card

Front I/O

  • RJ-45

    1 x GbE (RJ-45)

  • RJ-45

    1 x GbE (RJ-45)

  • HDMI

    1x HDMI 1.4

  • Audio

    1x Mic in, 1x Speaker

  • Antenna

    2x Antenna Holes

  • LED Indicator

    1 x PWR LED

  • USB

    2 x USB 3.1 Gen1 Type A
    4 x USB 2.0

  • Serial

    1 x RS-232/RS485 (RX, TX, RTS, CTS) (DB9)

  • GPIO

    1 x 16-bit DIO

Extended I/O interface

  • Extended I/O interface

    1 x GbE (RJ-45)
    2 x USB 3.1 Gen1 Type A
    4 x USB 2.0
    1 x HDMI 1.4
    1 x Mic in, 1x Speaker
    2 x Antenna Holes
    1 x RS-232/RS485 (RX, TX, RTS, CTS) (DB9)
    1 x 16-bit DIO

  • Extended I/O interface

    1 x GbE (RJ-45)
    2 x USB 3.1 Gen1 Type A
    4 x USB 2.0
    1 x HDMI 1.4
    1 x Mic in, 1x Speaker
    2 x Antenna Holes
    1 x RS-232/RS485 (RX, TX, RTS, CTS) (DB9)
    1 x 16-bit DIO

Power Requirement

  • DC Input Connector

    DC jack

  • DC Input Connector

    DC jack

  • Power Requirement

    DC 12V

Software Support

  • OS

    Andriod 14

  • OS

    Andriod 14

Mechanical & Environmental

  • Operating Temp.

    -20°C~60°C

  • Operating Temp.

    -20°C~60°C

  • Storage Temp.

    -40 to 85°C

  • Dimension (W x L x H)

    145mm x 34mm x 96mm (TBD)

  • Mounting Kit

    DIN Rail Mount

  • Structure

    Sheet Metal
    Fann Connector (option) (TBD)