RSC-IMX8M
3.5 NXP IMX8M SBC
- NXP® i.MX8M Quad ARM Cortex A53 Quad Core Up to 1.5GHz; Cortex-M4 core processor(Default)
- 2GB LPDDR4
- 16GB eMMC
- -20°C ~ 85°C (- 4°F ~ 185°F)
- CE, FCC Class B
仕様
System Information
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Processor
NXP i.MX8M Cortex-A53 Quad Core 1.3GHz; Cortex-M4 core processor
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System Memory
2GB DDR4/ (expandable to 4GB Max)
Software Support
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OS
Yocto 2.5(Default )
Android
Storage
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Storage
16GB eMMC / (expandable to 64GB Max)
Display
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Multiple Display
HDMI / LVDS / MIPI DSI
Ethernet
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LAN Chipset
LAN 1: Intel I210
LAN 2: RTL8211 -
LAN Port
2 x RJ45
Power Requirement
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DC Input
DC IN 12~24V (Note: LVDS and MIPI only support 12V input）
Certification
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Certification Information
CE
FCC Class B
I/O
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External I/O Connector
1 x USB 3.0 Type A
2 x Gigabit LAN
1 x HDMI connector (Vertical type)
1 x USB 3.0 Type C (Data only)
1 x Micro SD socket
1 x Headphone Jack
1 x Reset
1 x Power LED (Green)( Only power on, no standby light.)
1 x 1 x DC Jack (J6) / 1 x 1x4P Header (J24) -
Internal I/O Connector
1 x Front Panel(1 x HDR 2 x 6 (J21))
1 x Backlight
1 x MIPI CSI (1 x DF13 20P Header)
1 x LVDS (1 x DF13 40P Header)
1 x 2 x 10 P Header (USB3.0)
1 x 2230 M.2 for WiFi/BT (PCIe& USB Channel)
1 x 3042 M.2 for 3G/4G Module (USB Only)
1 x SIM Socket (For Use LTE M.2 Card)
2 x Speaker out (1x2P Header )
1 x Power LED
1 x RTC battery
1 x Mic-In
1 x 2x20P HeaderExtend connector (J22)
(for option Expansion I/O board for RS232/485/GPIO/CAN)
Mechanical & Environmental
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Operating Temp.
-20°C ~ 85°C (- 4°F ~ 185°F)
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Storage Temp.
-20°C ~ 85°C (- 4°F ~ 185°F)
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Dimension (L x W)
146 x 102 mm
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Weight
0.15 kg
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Operating Humidity
0% ~ 90% Relative Humidity, Non-condensing
Ordering Information
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Ordering Information
RSC-IMX8M-3W-A300R : 3.5" NXP i.MX8MQ, 2GB LPDDR4, 16GB eMMC, GLANx2, A03 (-20~85 Degree)
RSC-IMX8M-9W-A300R : Expansion I/O board RS232/485/GPIO, A02(-20~85 Degree)