ECM-TGU

11th Gen Intel® Core™ SoC i7/i5/i3 & Celeron BGA Processor 3.5” Micro Module

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製品機能

Bottom Layer Soldered Processor
Single 260-pin SO-DIMM DRAM Socket, Max, Up to 32GB DDR4 3200MTs (non-ECC Supported)
Four Display, 2 x DP++, 1 x 2CH LVDS, 1 x eDP
Expansion Slot, M.2 Key-B, M.2 Key-E, M.2 Key-M
Three Gigabit Ethernet, 1 x 2.5GbE, 2 x 1GbE
DC in +12V ~ +24V

仕様

System Information

Processor

11th Gen. Intel® Core™ SoC i7/i5/i3 & Celeron® BGA Processor
Intel® Core™ i7-1185G7E, i7-1185GRE (up to 4.4GHz, quad-core, 12M Cache, TDP: 28/15W)
Intel® Core™ i5-1145G7E, i5-1145GRE (up to 4.1GHz, quad-core, 8M Cache, TDP: 28/15W)
Intel® Core™ i3-1115G4E, i3-1115GRE (up to 3.9GHz, dual-core, 6M Cache, TDP: 28/15W)
Intel® Celeron® 6305E (up to 1.8GHz, dual-core, 4M Cache, TDP: 15W)
System Memory

1 x 260-pin DDR4 3200MHz SO-DIMM Socket, Supports Up to 32GB Max. (non ECC only)
I/O Chipset

EC iTE IT8528E
Watchdog Timer

H/W Reset: 1Sec. ~ 65535Sec./Min. and1 Sec. or 1Min./Step
BIOS

AMI BIOS, 256Mbit SPI Flash ROM
H/W Status Monitor

CPU & System Temperature Monitoring Voltages Monitoring
TPM

Onboard nuvoTon NPCT754AADYX Supports TPM 2.0
Board

3.5"

Expansion

Expansion

1 x M.2 Type E 2230 supports WiFi module (with PCIe x1 & USB 2.0 Signal)
1 x M.2 Type B 3042/2242 (with PCIe x1, SATA and USB 2.0 Signal, with 1 x SIM card slot) Standard Package with 52 to 42 Bracket + screw set ;Supports 4G, no 5G (no USB3.0 Signal).
1 x M.2 Type M supports 2260/2242 (with 1 x PCIe Gen4 x4 Signal). Standard Package with 60 to 42 Bracket + screw set

Expansion

1 x M.2 Type E 2230 supports WiFi module (with PCIe x1 & USB 2.0 Signal)
1 x M.2 Type B 3042/2242 (with PCIe x1, SATA and USB 2.0 Signal, with 1 x SIM card slot) Standard Package with 52 to 42 Bracket + screw set ;Supports 4G, no 5G (no USB3.0 Signal).
1 x M.2 Type M supports 2260/2242 (with 1 x PCIe Gen4 x4 Signal). Standard Package with 60 to 42 Bracket + screw set

Storage

Display

Graphic Chipset

Intel® 12th Generation CPU Integrated
Spec. & Resolution

DP++ Max resolution 4096 x 2160@60Hz
LVDS Max resolution 1920 x 1080 Dual channel 18/24-bits
eDP1.3 Max resolution 4096 x 2160@60Hz
Multiple Display

Four Display
LVDS

1 x LVDS: 1920 x 1080 Dual channel 18/24-bits LVDS (Chrontel CH7511B-BFI eDP to LVDS)

Audio

Ethernet

LAN Chipset

3 x Intel® I226LM for Standard Temperature/ Intel® I226IT for Extend Temperature

LAN Chipset

3 x Intel® I226LM for Standard Temperature/ Intel® I226IT for Extend Temperature
Ethernet Interface

10/100/1000/2.5G Base-Tx GbE compatible
LAN Port

3 x RJ-45

Power Requirement

Software Support

Certification

I/O

Mechanical & Environmental

Operating Temp.

Standard Temperature: 0°C ~ 60°C (32~140°F) with 0.5m/s Air Flow
Wide Temperature: -20°C ~ 60°C(-4~140°F) with 0.5m/s Air Flow for Wide Temp CPU SKU

Operating Temp.

Standard Temperature: 0°C ~ 60°C (32~140°F) with 0.5m/s Air Flow
Wide Temperature: -20°C ~ 60°C(-4~140°F) with 0.5m/s Air Flow for Wide Temp CPU SKU
Storage Temp.

-40°C ~ 75°C (-40°F ~ 167°F)
Operating Humidity

40°C @ 95% Relative Humidity, Non-condensing
Weight

0.44lbs (0.2kg)
Power Requirement

DC in +12V ~ +24V
Dimension (L x W)

5.7" x 4" (146mm x 101mm)

Ordering Information

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