安勤

OSM-IMX8MM

Open Standard Module-Computer on Module with  NXP i.MX8M Mini Arm Cortex-A53

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製品機能
  • OSM 1.1 size-L type 45*45mm
  • Enhanced reliability for mobile edge devices
  • 2GB LPDDR4
  • 8GB eMMC
  • Wide operating temperature: -40~85℃ 
  • OS supports Yocto 2.5 and 4.0

仕様

System Information

  • System Memory

    2GB LPDDR4

  • System Memory

    2GB LPDDR4

  • Processor

    Quad-core Cortex-A53
    Core Cortex-M4

  • Chipset

    NXP iMX8M Mini Arm

Storage

  • Storage

    8GB eMMC 5.1

  • Storage

    8GB eMMC 5.1

OSM Module I/O

  • PCIe

    1 x 2.0

  • PCIe

    1 x 2.0

  • GPIO

    x 24 ( 3 share with PWM)

  • HDMI

    x 1 , 4k60Hz

  • I2C

    x 3

  • MIPI CSI

    x 1 (4 lane)

  • MIPI DSI

    x 1 (4 lane)

  • SPDIF

    x 1

  • I2S

    x 1

  • SPI

    x 2

  • LAN

    1 x Ethernet 1000M

  • SDIO

    2 x SDIO 3.0

  • COM

    1 x debugging port
    3 x UART

  • USB Port

    2 x USB Host 2.0

Certifications

  • Certification Information

    CE, FCC Class B

  • Certification Information

    CE, FCC Class B

Mechanical & Environmental

  • Storage Temperature

    -40~95 Degree

  • Storage Temperature

    -40~95 Degree

  • Dimension

    45mm x 45mm (Size-L)

  • Power Requirement

    DC input voltage 5V

  • Operating Humidity

    5% to 95%, non-condensing

  • Operating Temperature

    Industry：-40~85 Degree

Software Support

  • OS Information

    Yocto 2.5 and 4.0

  • OS Information

    Yocto 2.5 and 4.0

Ordering Information

  • Ordering Information

    TBD

  • Ordering Information

    TBD

Development board Interfaces

  • Gigabit Ethernet

    x 1 Port(JP2 Support POE PD Function with POE Module)

  • Gigabit Ethernet

    x 1 Port(JP2 Support POE PD Function with POE Module)

  • Wi-Fi/BT

    AP6275S module,support 802.11 a/b/g/n/ac

  • USB

    x 2 (2 x USB 2.0 Type A, 1 x Expansion Connector)

  • Micro SD Slot

    x 1

  • SIM Card Slot

    x 1

  • Mini-PCIE

    x 1 (Support 4G module)

  • MIPI CSI

    x 1

  • IR Module

    x 1 (Support USB IR RECEIVE MODULE)

  • Speaker

    x 1

  • DC-IN

    12V/2A

  • SW

    K1 (Recovery mode)

  • Dimensions

    125 x 120 mm

Dimensions

  • Dimensions

    125 x 120 mm

  • Dimensions

    125 x 120 mm

Chipset

  • Chipset

    NXP iMX8M Mini

  • Chipset

    NXP iMX8M Mini

Market Area

  • Market Area

    Global

  • Market Area

    Global

OSM Module I/O

  • EMMC FLASH

    16 GB eMMC 5.1

  • EMMC FLASH

    16 GB eMMC 5.1

  • LPDDR4

    2 GB

  • CPU

    4 x Cortex A53 core up to 1.8GHz per core
    1 x Cortex M4 core up to 400 MHz

  • OS

    Yocto(Linux) / Android

Development board interfaces

  • SW

    K1 Recovery mode

  • SW

    K1 Recovery mode

  • DC IN

    12V2A

  • Speaker

    *1

  • IR Module

    *1 (Support USB IR RECEIVE MODULE)

  • MIPI CSI

    *1

  • PoE PD

    *1

  • Mini PCIE

    *1 (Support 4G module)

  • SIM Card Slot

    *1

  • TF Slot

    *1

  • USB 2.0

    *2 (2 * USB 2.0 Type A, 1* Expansion Connector)

  • Wifi/BT

    AP62755 module, support 802.11 a/b/g/n/ac

  • Gigabit Ethernet

    * 1 Port (JP2 Support POE PD Function with POE Module)