安勤

ESM-TGH

PICMG COM R3.0 Type 6 module with Intel® 11th Generation Xeon® / Core™ i7/i5/i3 / Celeron® BGA Processors Type6 COMe Basic Module

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製品機能
  • PICMG COM R3.0 Type 6 Module with Intel® 11th Generation Xeon®, Core™ i7/i5/i3, Celeron® BGA Processor
  • 3 x 260-Pin DDR4 3200MHz SO-DIMM Slot Up to 32 GByte Each (96 GByte Total)
  • 1 x Intel® I225LM/IT
  • Intel® HD Audio Integrated on CPU
  • Onboard TPM 2.0 Optional
  • COMe Type 6 Basic Size: 3.74" x 4.92" (125*95 mm)
  • DC in +9V ~ +19V

仕様

System Information

  • Processor

    11th Gen. Intel® Xeon® Core™ and Celeron® Processor
    Xeon® W-11865MRE* 45W (35W cTDP), 8C/16T (ECC)
    Xeon® W-11155MRE* 45W (35W cTDP), 4C/8T (ECC)
    Core™ i7-11850HE* 45W (35W cTDP), 8C/16T (Non-ECC)
    Core™ i5-11500HE* 45W (35W cTDP), 6C/12T (Non-ECC)
    Core™ i3-11100HE* 45W (35W cTDP), 4C/8T (Non-ECC)
    Celeron® 6600HE* 35W, 2C/2T (Non-ECC)

  • Processor

    11th Gen. Intel® Xeon® Core™ and Celeron® Processor
    Xeon® W-11865MRE* 45W (35W cTDP), 8C/16T (ECC)
    Xeon® W-11155MRE* 45W (35W cTDP), 4C/8T (ECC)
    Core™ i7-11850HE* 45W (35W cTDP), 8C/16T (Non-ECC)
    Core™ i5-11500HE* 45W (35W cTDP), 6C/12T (Non-ECC)
    Core™ i3-11100HE* 45W (35W cTDP), 4C/8T (Non-ECC)
    Celeron® 6600HE* 35W, 2C/2T (Non-ECC)

  • Platform Controller Hub

    Intel® RM590E Chipset
    Intel® QM580E Chipset
    Intel® HM570E Chipset

  • System Memory

    3 x 260-Pin DDR4 3200MHz SO-DIMM Slot Up to 32 GByte Each (96 GByte Total)

  • I/O Chipset

    EC iTE IT5571

  • Watchdog Timer

    H/W Reset, 1Sec. ~ 65535Sec. and 1Sec./Step

  • BIOS

    AMI uEFI BIOS, 256 Mbit SPI Flash ROM

  • H/W Status Monitor

    Monitoring System Temperature
    Voltage and FAN Status with Auto Throttling Control

  • TPM

    Onboard TPM 2.0 Optional

Expansion

  • Expansion

    1 x PCIe x16 (Gen4)
    8 x PCIe x1 (Gen3)

  • Expansion

    1 x PCIe x16 (Gen4)
    8 x PCIe x1 (Gen3)

Display

  • Graphic Chipset

    Intel® UHD Graphics (Xe Architecture)

  • Graphic Chipset

    Intel® UHD Graphics (Xe Architecture)

  • Spec. & Resolution

    HDMI 2.0b: 4096x 2304@60Hz
    DP 1.4: 4096x 2304@60Hz
    LVDS: 1920x 1080@60Hz, Support Dual Channel 18/24-bit LVDS (Via eDP-to-LVDS IC CH7511B)
    VGA: 1920x 1200@60Hz (Via DP to VGA IC Chrontel® 7517A)
    eDP 1.4b: 4096x 2304@60Hz (Optional), (Per Intel Design Guide, Need to Add Redriver (Redriver in Carrier Board to Fine Tune the Signal of DP1.4)
    (Only Support 4Lanes 2560x1440 & 2Lanes 1920x1080)

  • Multiple Display

    Four Display Support, Up to 2K (3DDI+eDP)

  • LVDS

    CH7511B(eDP to LVDS)

  • DDI

    3 x DDI, VGA, eDP/LVDS (BOM Optional)
    HDMI/DP(Default)
    VGA Supported by Build Option Via DP-to-VGA IC (In Place of DDI 3)

Audio

  • Audio Interface

    Intel® HD Audio Integrated on CPU

  • Audio Interface

    Intel® HD Audio Integrated on CPU

Ethernet

  • LAN Chipset

    1 x Intel® I225LM/IT

  • LAN Chipset

    1 x Intel® I225LM/IT

  • Ethernet Interface

    10/100/1000/2500 Base-Tx GbE Compatible

Software Support

  • OS

    Windows 10 64-bit
    Linux (Kernel 5.8) above

  • OS

    Windows 10 64-bit
    Linux (Kernel 5.8) above

Certification

  • Certification Information

    CE, FCC Class, RoHS Compliant

  • Certification Information

    CE, FCC Class, RoHS Compliant

I/O

  • USB

    4 x USB 3.2 Gen.2 x 1
    8 x USB 2.0

  • USB

    4 x USB 3.2 Gen.2 x 1
    8 x USB 2.0

  • COM Port

    2 x UART (RX/TX Only)

  • SATA

    4 x SATA III

  • DIO

    1 x 8-bit GPIO

  • MIO

    1 x SMBus
    1 x LPC (Via eSPI to LPC Bridge)
    1 x I2C

Mechanical & Environmental

  • Operating Temp.

    Standard 0°C ~ 60°C (32°F ~ 140°F)
    Operating Industrial (Build Option with Selected SKUs): -40°C ~ 75°C (-40°F ~ 167°F)

  • Operating Temp.

    Standard 0°C ~ 60°C (32°F ~ 140°F)
    Operating Industrial (Build Option with Selected SKUs): -40°C ~ 75°C (-40°F ~ 167°F)

  • Storage Temp.

    -40°C ~ 85°C (-40°F ~ 185°F)

  • Operating Humidity

    40°C @ 95% Relative Humidity, Non-condensing

  • Weight

    0.44lbs (0.2Kg)

  • Power Requirement

    +9V ~ +19V

  • Power Mode

    AT/ATX

  • Dimension (L x W)

    3.74" x 4.92" (125*95 mm)

Ordering Information

  • Ordering Information

    ESM-TGH-1850-A1R
    Intel® HM570E COM Express Module Type 6 on board-i7-11850HE CPU

    ESM-TGH-1500-A1R
    Intel® HM570E COM Express Module Type 6 on board-i5-11500HE CPU

    ESM-TGH-1100-A1R
    Intel® HM570E COM Express Module Type 6 on board-i3-11100HE CPU

    ESM-TGH-6600-A1R
    Intel® HM570E COM Express Module Type 6 on board-Celeron 6600HE CPU

    ESM-TGH-1850-A1-1R
    Intel® QM580E COM Express Module Type 6 on board-i7-11850HE CPU

    ESM-TGH-1500-A1-1R
    Intel® QM580E COM Express Module Type 6 on board-i5-11500HE CPU

    ESM-TGH-1865R-A1R
    Intel® RM590E COM Express Module Type 6 on board-Xeon W-11865MRE CPU

    ESM-TGH-1155R-A1R
    Intel® RM590E COM Express Module Type 6 on board-Xeon W-11155MRE CPU

  • Ordering Information

    ESM-TGH-1850-A1R
    Intel® HM570E COM Express Module Type 6 on board-i7-11850HE CPU

    ESM-TGH-1500-A1R
    Intel® HM570E COM Express Module Type 6 on board-i5-11500HE CPU

    ESM-TGH-1100-A1R
    Intel® HM570E COM Express Module Type 6 on board-i3-11100HE CPU

    ESM-TGH-6600-A1R
    Intel® HM570E COM Express Module Type 6 on board-Celeron 6600HE CPU

    ESM-TGH-1850-A1-1R
    Intel® QM580E COM Express Module Type 6 on board-i7-11850HE CPU

    ESM-TGH-1500-A1-1R
    Intel® QM580E COM Express Module Type 6 on board-i5-11500HE CPU

    ESM-TGH-1865R-A1R
    Intel® RM590E COM Express Module Type 6 on board-Xeon W-11865MRE CPU

    ESM-TGH-1155R-A1R
    Intel® RM590E COM Express Module Type 6 on board-Xeon W-11155MRE CPU