安勤

ESM-ARL

COM Express Rev. 3.1 COMe Type 6 Basic Module with Intel® Core™ Ultra Processor U/H Series (TDP 28W/15W)

/upload/2025_02_12/11_20250212102348bfrg160.png

PDFをエクスポート

製品機能
  • COM Express Rev. 3.1 COMe Type 6 Basic Module with Intel® Core™ Ultra Processor U/H Series (TDP 28W/15W)
  • Dual-CH 2 x 262-pin DDR5 5600MHz SO-DIMM up to 96GB
  • 1 x Intel® i226LM 2.5G Gigabit Controller
  • Intel® HD Audio integrated in SoC
  • On board Storage NvMe SSD (Optional)
  • Onboard NuvoTon NPCT760AABYX support TPM 2.0
  • COMe Type 6 Basic Size: 4.92" x 3.74" (125*95 mm)
  • DC in +9V ~ +19V

仕様

System Information

  • Processor

    Intel® Core™ Ultra Processor U/H Series (TDP 28W/15W)

  • Processor

    Intel® Core™ Ultra Processor U/H Series (TDP 28W/15W)

  • System Memory

    2 x 262-Pin DDR5 5600MT/s SO-DIMM Up to 96GB

  • I/O Chipset

    EC ITE IT5782VG-I-128/BX

  • Watchdog Timer

    65536 level, 0 ~ 65535 sec

  • BIOS

    AMI 256Mb UEFI BIOS, 256Mbit SPI Flash ROM

  • H/W Status Monitor

    Monitoring CPU Temperature, Voltage with Auto Throttling Control

  • TPM

    Onboard NuvoTon NPCT760AABYX support TPM 2.0, co-lay Infineon SLB9670VQ2.0 FW7.85

Expansion

  • Expansion

    PEG (H series): 1 x PCIe x8 Gen5, 2 x PCIe x4 Gen4
    PEG (U series): 3 x PCIe x4 Gen4
    PCIe: Max 5 x PCIe x1 Gen4 or 1 x PCIe x1 Gen4,1 x PCIe x4 Gen 4 (configurable x1, or x2, or x4)

  • Expansion

    PEG (H series): 1 x PCIe x8 Gen5, 2 x PCIe x4 Gen4
    PEG (U series): 3 x PCIe x4 Gen4
    PCIe: Max 5 x PCIe x1 Gen4 or 1 x PCIe x1 Gen4,1 x PCIe x4 Gen 4 (configurable x1, or x2, or x4)

Storage

  • Storage

    1 x NvMe (Option)

  • Storage

    1 x NvMe (Option)

Display

  • Graphic Chipset

    Intel® Xe LPG

  • Graphic Chipset

    Intel® Xe LPG

  • Spec. & Resolution

    DDI (HDMI/Display Port):
    Up to 3 x DDI Port Support Configurable HDMI/DisplayPort
    -HDMI 2.1: 4096 x 2304 @ 60Hz
    -DisplayPort 1.4 8K60
    LCD (LVDS/eDP):
    1 x LVDS (via CH7511B eDP-to-LVDS): 1920x1200 @60Hz (Default); or 1 x eDP 1.4b(By BOM Optional): Max 4K

  • Multiple Display

    Quad Simultaneous Independent Display

  • LVDS

    1 x LVDS (via CH7511B eDP-to-LVDS): 1920x1200 @60Hz

  • DDI

    Up to 3 x DDI Port Support Configurable HDMI/DisplayPort
    -HDMI 2.1: 4096 x 2304 @ 60Hz
    -DisplayPort 1.4 8K60

Audio

  • Audio Codec

    Intel® HD Audio integrated in SoC

  • Audio Codec

    Intel® HD Audio integrated in SoC

Ethernet

  • LAN Chipset

    1 x Intel® i226 2.5G Gigabit Controller

  • LAN Chipset

    1 x Intel® i226 2.5G Gigabit Controller

  • Ethernet Interface

    10/100/1000/2500 Base-Tx GbE compatible

Software Support

  • OS

    Windows 11, Ubuntu 24.04

  • OS

    Windows 11, Ubuntu 24.04

Certification

  • Certification Information

    CE, FCC Class, RoHS Compliant

  • Certification Information

    CE, FCC Class, RoHS Compliant

I/O

  • USB

    USB4: Up to 2 ports, Co-lay with DDI and in place of DDI1 & DDI2
    USB3.2 (Gen2): 4 Ports (10 Gbps)
    USB2.0: 8 Ports (480 Mbps)

  • USB

    USB4: Up to 2 ports, Co-lay with DDI and in place of DDI1 & DDI2
    USB3.2 (Gen2): 4 Ports (10 Gbps)
    USB2.0: 8 Ports (480 Mbps)

  • COM Port

    2 x UART (RX/TX Only)

  • SATA

    2 x SATAIII (6.0Gb/s)

  • DIO

    8 bit GPIO from EC

  • MIO

    1 x SMBus
    1 x LPC (via eSPI-to-LPC bridge IC ITE_IT8883FN)
    1 x I2C
    1 x SPI

Mechanical & Environmental

  • Operating Temp.

    Standard 0°C ~ 60°C (32°F ~ 140°F)

  • Operating Temp.

    Standard 0°C ~ 60°C (32°F ~ 140°F)

  • Storage Temp.

    -40°C ~ 75°C (-40°F ~ 167°F)

  • Operating Humidity

    40°C @ 95% Relative Humidity, Non-condensing

  • Weight

    0.226lbs (0.101Kg) without NvMe
    0.227lbs (0.103Kg) with NvMe

  • Power Requirement

    +9V~+19V

  • Power Mode

    AT/ATX

  • Dimension (L x W)

    4.92" x 3.74" (125*95 mm)

Ordering Information

  • Ordering Information

    TBD

  • Ordering Information

    TBD