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EEV-HC10
COM-HPC Carrier Board in EATX Form Factor (12” x 13”, 305 x 330mm)
- EATX form factor (12” x 13”, 305 x 330mm)
- PICMG®COM-HPC® Revision 1.2, COM-HPC client pin-out, size A(95x120mm), B(120x120mm), and C(160x120mm) compatible
- Unmanaged COM-HPC Carrier (C.U.)
- 1 x PCIex16 Gen5 slot, 8 x PCIex4 slot , 1 x PCIex1 slot for BMC
- 3 x DDI configurable to DP1.4a or HDMI 2.1b by 2x IET module, 1 x eDP
- 2 x 10 or 25 Gigabit Ethernet connector by 1x IET module
- 2 x 2.5 Gigabit Ethernet connector + 4 x USB3.2 Gen2x2 (Type C) by 2x IET module
- 4 x USB2.0 by pin header
- 2 x SATAIII
- 12-bit GPIO
产品规格
System Information
-
Processor
EATX form factor (12” x 13”, 305 x 330mm), PICMG®COM-HPC® Revision 1.2, COM-HPC client pin-out, size A(95x120mm), B(120x120mm), and C(160x120mm) compatible
Expansion
-
Expansion
1 x PCIex16 Gen5 slot
8 x PCIex4 slot
1 x PCIex1 slot for BMC
Display
-
Multiple Display
Depends on the COM-HPC module
-
DDI
3 x DDI configurable to DP2.1 or HDMI 2.1b by 2x IET module
1 x eDP
Audio
-
Audio Codec
Realtek ALC888S HD Audio Decoding Controller
-
Audio Interface
Line-out, Mic-in
Ethernet
-
Ethernet Interface
2 x 10 or 25 Gigabit Ethernet connector by 1x IET module
2 x 2.5 Gigabit Ethernet connector by 2x IET module
Software Support
-
OS
According to COM-HPC Module Solution
Certification
-
Certification Information
CE, FCC, RoHS Compliant
I/O
-
USB
4 x USB3.2 Gen2x2 (Type C) by 2x IET module
4 x USB2.0 by pin header -
GPIO
12-bit GPIO
-
UART
2 x Serial Port (2-wire UART)
Mechanical & Environmental
-
Operating Temp.
0°C ~ 60°C (32°F ~ 140°F) with 0.5m/s air flow
-
Storage Temp.
-20°C ~ 75°C (-4°F ~ 167°F)
-
Operating Humidity
40°C @ 95% Relative Humidity, Non-condensing
-
Dimension (L x W)
12” x 13” (305 x 330mm)
Ordering Information
-
Ordering Information
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