ESM-TGH
PICMG COM R3.0 Type 6 module with Intel® 11th Generation Xeon® / Core™ i7/i5/i3 / Celeron® BGA Processors Type6 COMe Basic Module
- PICMG COM R3.0 Type 6 Module with Intel® 11th Generation Xeon®, Core™ i7/i5/i3, Celeron® BGA Processor
- 3 x 260-Pin DDR4 3200MHz SO-DIMM Slot Up to 32 GByte Each (96 GByte Total)
- 1 x Intel® I225LM/IT
- Intel® HD Audio Integrated on CPU
- Onboard TPM 2.0 Optional
- COMe Type 6 Basic Size: 3.74" x 4.92" (125*95 mm)
- DC in +9V ~ +19V
规格
System Information
-
Processor
11th Gen. Intel® Xeon® Core™ and Celeron® Processor
Xeon® W-11865MRE* 45W (35W cTDP), 8C/16T (ECC)
Xeon® W-11155MRE* 45W (35W cTDP), 4C/8T (ECC)
Core™ i7-11850HE* 45W (35W cTDP), 8C/16T (Non-ECC)
Core™ i5-11500HE* 45W (35W cTDP), 6C/12T (Non-ECC)
Core™ i3-11100HE* 45W (35W cTDP), 4C/8T (Non-ECC)
Celeron® 6600HE* 35W, 2C/2T (Non-ECC) -
Platform Controller Hub
Intel® RM590E Chipset
Intel® QM580E Chipset
Intel® HM570E Chipset -
System Memory
3 x 260-Pin DDR4 3200MHz SO-DIMM Slot Up to 32 GByte Each (96 GByte Total)
-
I/O Chipset
EC iTE IT5571
-
Watchdog Timer
H/W Reset, 1Sec. ~ 65535Sec. and 1Sec./Step
-
BIOS
AMI uEFI BIOS, 256 Mbit SPI Flash ROM
-
H/W Status Monitor
Monitoring System Temperature
Voltage and FAN Status with Auto Throttling Control -
TPM
Onboard TPM 2.0 Optional
Expansion
-
Expansion
1 x PCIe x16 (Gen4)
8 x PCIe x1 (Gen3)
Display
-
Graphic Chipset
Intel® UHD Graphics (Xe Architecture)
-
Spec. & Resolution
HDMI 2.0b: 4096x 2304@60Hz
DP 1.4: 4096x 2304@60Hz
LVDS: 1920x 1080@60Hz, Support Dual Channel 18/24-bit LVDS (Via eDP-to-LVDS IC CH7511B)
VGA: 1920x 1200@60Hz (Via DP to VGA IC Chrontel® 7517A)
eDP 1.4b: 4096x 2304@60Hz (Optional), (Per Intel Design Guide, Need to Add Redriver (Redriver in Carrier Board to Fine Tune the Signal of DP1.4)
(Only Support 4Lanes 2560x1440 & 2Lanes 1920x1080) -
Multiple Display
Four Display Support, Up to 2K (3DDI+eDP)
-
LVDS
CH7511B(eDP to LVDS)
-
DDI
3 x DDI, VGA, eDP/LVDS (BOM Optional)
HDMI/DP(Default)
VGA Supported by Build Option Via DP-to-VGA IC (In Place of DDI 3)
Audio
-
Audio Interface
Intel® HD Audio Integrated on CPU
Ethernet
-
LAN Chipset
1 x Intel® I225LM/IT
-
Ethernet Interface
10/100/1000/2500 Base-Tx GbE Compatible
Software Support
-
OS
Windows 10 64-bit
Linux (Kernel 5.8) above
Certification
-
Certification Information
CE, FCC Class, RoHS Compliant
I/O
-
USB
4 x USB 3.2 Gen.2 x 1
8 x USB 2.0 -
COM Port
2 x UART (RX/TX Only)
-
SATA
4 x SATA III
-
DIO
1 x 8-bit GPIO
-
MIO
1 x SMBus
1 x LPC (Via eSPI to LPC Bridge)
1 x I2C
Mechanical & Environmental
-
Operating Temp.
Standard 0°C ~ 60°C (32°F ~ 140°F)
Operating Industrial (Build Option with Selected SKUs): -40°C ~ 75°C (-40°F ~ 167°F) -
Storage Temp.
-40°C ~ 85°C (-40°F ~ 185°F)
-
Operating Humidity
40°C @ 95% Relative Humidity, Non-condensing
-
Weight
0.44lbs (0.2Kg)
-
Power Requirement
+9V ~ +19V
-
Power Mode
AT/ATX
-
Dimension (L x W)
3.74" x 4.92" (125*95 mm)
Ordering Information
-
Ordering Information
ESM-TGH-1850-A1R
Intel® HM570E COM Express Module Type 6 on board-i7-11850HE CPU
ESM-TGH-1500-A1R
Intel® HM570E COM Express Module Type 6 on board-i5-11500HE CPU
ESM-TGH-1100-A1R
Intel® HM570E COM Express Module Type 6 on board-i3-11100HE CPU
ESM-TGH-6600-A1R
Intel® HM570E COM Express Module Type 6 on board-Celeron 6600HE CPU
ESM-TGH-1850-A1-1R
Intel® QM580E COM Express Module Type 6 on board-i7-11850HE CPU
ESM-TGH-1500-A1-1R
Intel® QM580E COM Express Module Type 6 on board-i5-11500HE CPU
ESM-TGH-1865R-A1R
Intel® RM590E COM Express Module Type 6 on board-Xeon W-11865MRE CPU
ESM-TGH-1155R-A1R
Intel® RM590E COM Express Module Type 6 on board-Xeon W-11155MRE CPU